全自動上下片-Load/Unload capability for Wafer Ring Cette
雙主軸-Dual-head Spindle
自動清洗功能-Built-in Auto-washing station
可加工12英寸晶片或310mm工件-Cater up to 12"chuck table or 310mm work piece
水量監控-Detection sensor for incoming water
CS-Contact blade setup or VBS-Vertical non-contact blade setup
PRS識別系統-PRS-Pattern Recognition System
多通道-Multi Pattern Recognition
間距自動檢查-Auto Pitch Check
刀具壽命監測-Blade Lifespan Monitoring System
切割方向-Cut direction setup（Up/down cut）
Hairline＆Saw street adjustment capability
Multi-Channel Programming
刀破檢測-BBD-Blade Breakage Detector
雙主軸-Dual-head Spindle
自動清洗功能-Built-in Auto-washing station
可加工12英寸晶片或310mm工件-Cater up to 12"chuck table or 310mm work piece
水量監控-Detection sensor for incoming water
CS-Contact blade setup or VBS-Vertical non-contact blade setup
PRS識別系統-PRS-Pattern Recognition System
多通道-Multi Pattern Recognition
間距自動檢查-Auto Pitch Check
刀具壽命監測-Blade Lifespan Monitoring System
切割方向-Cut direction setup（Up/down cut）
Hairline＆Saw street adjustment capability
Multi-Channel Programming
刀破檢測-BBD-Blade Breakage Detector
